| Intel is revolutionizing the future of silicon with the groundbreaking Intel 18A process node technology and state-of-the-art packaging. The introduction of Intel 18A with RibbonFET and PowerVia represents the most significant leap in transistor innovation since Intel introduced FinFET in 2011, offering a significant increase in performance per watt and improved cell utilization. Moreover, the addition of Foveros 3D packaging adds exceptional versatility by enabling Intel 18A to be combined
with other nodes, delivering complex "systems of chips" instead of a traditional "system on chip." This revolutionary design helps increase density and boost performance for demanding use cases. |
